| Name |
Description |
Use |
| Etching |
Delicate removal of material from the irradiated site at low energy densities. |
Personalization of multi-layer circuits, circuit boards and wafer repair. |
| Scribing |
Removal of material from the irradiated site using high energy densities, penetrating only partially through the thickness, resulting in a trough as the beam is scanned. |
Direct write onto surfaces, cerating continuously variable patterns independent of mask. |
| Cutting |
Removal of material from the irradiated site using high energy densities, penetrating completely through the thickness resulting in a cut; separating two pieces as the beam is scanned. |
Flex-circuit fabrication, dicing of silicon wafers. |
| Drilling |
Removal of material from the irradiated site using high energy densities, penetrating completely through the thickness resulting in a "hole" as the beam is held stationary. |
MCM Fabrication, filter fabrication for biomedical devices. |
| Stripping |
Removal of material from the irradiated site (usually a 3 dimensional surface) using medium energy densities, leaving the underlying material free from any damage. |
Wire stripping, photo resist stripping. |
| Annealing |
Heat treating the irradiated area to the end result of permanently altering physical properties of the surface. |
Flat panel displays. |
| Marking |
Bleaching the irradiated area resulting in a color difference from the unexposed area. Physical properties of material are not changed when using low energy densities. |
Marking ceramic capacitors, SMD resistors, pills, cosmetics. |
